Compared to 12V systems, 48V power systems can reduce power losses and significantly increase power density. However, as voltage and power density increase, the reliability of passive components used at the output stage of power supply units (PSUs) becomes increasingly important.
In particular, capacitor failures in output-stage circuits densely populated with hundreds of passive components can lead to a critical power-supply malfunction, making a high level of reliability essential.
To meet these requirements, we introduce the high-reliability 1210 X7T 100V MFC (Molded Frame Capacitor), which effectively reduces the risk of cracks in ceramic capacitors.

MFC (Molded Frame Capacitor): The Growing Importance of Safer, Crack-Resistant Capacitors Alongside Electrical Performance at the Output of 48V AI Server PSUs

At the output stage of 48V AI server PSUs, hundreds of high-capacitance 1206/1210, 100V ceramic MLCCs with excellent electrical characteristics are used alongside aluminum capacitors to suppress voltage ripple. To overcome the limitations of conventional MLCCs, Samsung Electro-Mechanics has launched an MFC (Molded Frame Capacitor), a differentiated next-generation structure that combines a metal frame with epoxy molding.

Preventing Short Circuits by Completely Blocking Bending Cracks

Mechanical stress (PCB bending) generated during the manufacture and assembly of large PSU boards is one of the main causes of microcracks in the dielectric layers of conventional MLCCs.
Over time, these microcracks can cause short circuits in high-voltage environments.

MFC solution: The metal frame applied to the exterior of the MLCC cushions and absorbs PCB bending stress, minimizing the stress transmitted to the chip itself and fundamentally preventing the risk of cracking.

Withstanding Harsh Data Center Environments (Blocking Moisture and Dust)

High-performance AI servers are continuously exposed to high temperatures and electrical stress during continuous 24-hour operation. In addition, various environmental factors, such as dust ingress, changes in humidity, and contact with foreign matter, can reduce the reliability of components used on 100V high-voltage lines.

MFC solution: A differentiated epoxy-molding encapsulation structure reliably protects the entire chip. By providing effective protection from external humidity, dust, and physical dents (external impact), it enables stable performance and high reliability even in AI server power systems with high-voltage and high-reliability requirements.

Product Specifications

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