Summary

IT devices are rapidly transitioning into the era of On-Device AI, becoming thinner and more flexible while requiring higher integration density and performance.
As form factors continue to diversify, demand is growing for higher MLCC capacitance within limited spaces, directly driving increased demand for Low-Profile MLCCs and Embedded MLCCs.

① Changes in IT Device Form Factors

The form factors of IT devices are changing rapidly, led by smartphones, wearables, and foldable devices. Products continue to become thinner while expanding into diverse configurations that incorporate hinge structures and other mechanisms. As more camera, communication, and sensor modules are integrated, mounting density within limited spaces also continues to rise.
At the same time, power requirements are increasing due to the expansion of On-Device AI computing, while height and space constraints for component mounting are becoming more severe. The market therefore requires more advanced mounting solutions that can simultaneously satisfy the conflicting demands of being "thinner, denser, and more reliable."

② Why Low-Profile MLCCs?

As PCB mounting heights decrease, the thickness of individual components becomes a key factor in determining the overall device thickness. Our 0.5T / 0.65T Low-Profile MLCCs maintain the same capacitance at a lower mounting height, providing greater design flexibility in height-constrained areas for devices with diverse form factors, such as foldables and smart glasses. In particular, they minimize product thickness while ensuring equivalent capacitance and consistent reliability.

Device	Foldable SMP		Smart Glasses	TWS
Year	'2024	'2025~	'2025	'2025
Set F/F

③ Why Embedded MLCCs?

Low-profile designs alone are increasingly unable to meet both the need to accommodate more components and the demand for higher integration and performance. Unlike surface-mounted MLCCs, Embedded MLCCs are placed inside the PCB, freeing additional mounting space and further increasing mounting density within the same footprint. They also physically shorten the routing distance between the power delivery network (PDN) and the chipset, reducing impedance and better meeting the noise suppression and power stability requirements of high-performance chipsets and communication modules. As the evolution of foldable, ultra-slim, high-performance AI devices accelerates, Embedded MLCCs, along with Low-Profile MLCCs, are expected to become a core pillar of next-generation mounting solutions.

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