Introducing Ultra-Compact, Ultra-High-Capacitance MLCCs in Response to the Expansion of AI Edge Devices

  • Commercial
  • 2026.07.15

Abstract

With the advancement of On-Device AI technology, demand for real-time AI computing is rapidly increasing in wearable and edge devices such as smartwatches and AR/VR devices. Accordingly, demand for high-capacitance MLCCs for power stabilization is also growing.
As additional components such as AI accelerators, communication modules, and sensors are mounted, the available mounting area is becoming even more limited. At the same time, the demand for slimmer devices makes ultra-thin component profiles essential. Samsung Electro-Mechanics introduces its ultra-compact, ultra-high-capacitance MLCC line-up, which secures significantly improved capacitance within ultra-small sizes.

1. Adoption Trends and Future Outlook for Ultra-Compact, Ultra-High-Capacitance MLCCs Driven by the Expansion of AI Edge Devices

① Increase in Power Consumption Due to On-Device AI Computing

Recently, as the paradigm shift from cloud-dependent processing to On-Device AI accelerates, AP/NPU power consumption is increasing rapidly, generating large ripple and noise on power lines. High-capacitance MLCCs are required to effectively suppress these issues.

② Reduced Mounting Area Due to Additional Sensors and Components

As various sensors and components such as AI accelerators and communication modules (BT/Wi-Fi/UWB) are additionally mounted, the number of MLCCs required around each component also increases. However, since PCB area in wearable devices is extremely limited, the adoption of ultra-compact MLCCs that realize the same capacitance in smaller sizes is becoming inevitable.

③ Need for Ultra-Thin Profiles Due to Device Slimming

The latest smartwatches and healthcare patches are designed with ultra-slim profiles. Accordingly, MLCCs are also required to have ultra-thin profiles. (CL03A475MQ3CRN#, 0.39Tmax)

 

2. Future Outlook

As On-Device AI functions expand from premium models to mid- and low-end models, demand for ultra-compact, ultra-high-capacitance MLCCs is expected to spread even faster. The transition from existing 0603~0402 inch sizes to ultra-compact 0201~01005 inch sizes is expected to accelerate, and the adoption of ultra-high-capacitance products of 22µF or higher in the 0402 size is also expected to begin in earnest.

 

Introducing the Ultra-Compact, Ultra-High-Capacitance MLCC Line-up

To meet these market demands, Samsung Electro-Mechanics has established an ultra-compact, ultra-high-capacitance MLCC line-up optimized for AI edge devices and wearables. We introduce four products that minimize mounting area while maximizing capacitance.

[Line-up of Flagship Products]

Part Number Size
(inch/mm)		 Capacitance Related
Voltage		 TCC Thickness Sample Remarks
CL02A105MQ2NQN# 01005/0402 1µF 6.3Vdc X5R 0.25Tmax Available
CL03A475MQ3CRN# 0201/0603 4.7µF 6.3Vdc X6S 0.39Tmax Available Low Profile
CL03X106MS5C6W# 0201/0603 10µF 2.5Vdc X6S 0.55Tmax Available
CL05A226MP6NUN# 0402/1005 22µF 10Vdc X5R 0.8Tmax Available
LIST

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